I'm building a RF transmitter prototype and unfortunately cannot place all RF-components on the same side.So I'm coercing to pull 50 Ohm signal trace from CS through hole to PS. What should be a diameter of the signal via? Should I spread an additional vias (GND) around signal via?If yes- How many additional vias and what is their diameter?
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Answer by
Saumya Sharma
Yes, it is recommended to spread additional vias (GND) around the signal via. The number of additional vias and their diameter depend on the trace width and the desired impedance.
I'm building a RF transmitter prototype and unfortunately cannot place all RF-components on the same side.So I'm coercing to pull 50 Ohm signal trace from CS through hole to PS.
What should be a diameter of the signal via?
Should I spread an additional vias (GND) around signal via?If yes- How many additional vias and what is their diameter?
Yes, it is recommended to spread additional vias (GND) around the signal via. The number of additional vias and their diameter depend on the trace width and the desired impedance.